Mainboard|ASROCK|Intel B860|LGA 1851 (Socket V1)|micro ATX|RAM DDR5-SDRAM|2xSlots|1xNumber of M.2 (M) slots|B860M-XGEN5

  • Produkta kods: B860M-X GEN5
  • EAN: 4711581490727
  • Stāvoklis: Jauns
CenaSkaitsPiegāde

136.06 €

112.45 € (bez PVN 21%)

14

08.10.

Apraksts

X Series motherboard offers a compact, high-value solution, balancing performance, versatility, and reliability for both professional and daily tasks.

The ASRock X-Series motherboard provides a high-value solution, balancing performance and versatility within a compact form factor. It’s highly capable in handling a wide range of tasks, from professional productivity to everyday usage, striking an excellent balance between affordability, reliability, and efficiency.

6 Layer PCB
The 6 Layer PCB provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency for memory overclocking! Thus, it\'s able to support the latest memory modules with most extreme memory performance!

DDR5 XMP & EXPO Support
Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.

PCIe Gen5 Blazing M.2
The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128Gb/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

Aluminum Heatsink
The first thing that catches the eye is the optimized Aluminum Heatsink Design. Heatsinks are crucial for efficient heat dissipation, especially during heavy workloads like gaming or productivity tasks. Motherboard that built with heatsinks can effectively manage thermal performance, hence ensure system stability and durability effortlessly.

Dragon 2.5 Gb/s LAN
The intelligent 2.5Gb/s LAN platform is built for maximum networking performance for the demanding requirements of home networking, content creators, online gamers and high-quality streaming media. Boost networking performance up to 2.5X the bandwidth compared to the standard gigabit Ethernet, you’ll enjoy the faster and uncompromised connectivity experience for gaming, file transfers and backups.

POLYCHROME RGB
This motherboard features onboard RGB headers and addressable RGB headers that allow motherboard to be connected to compatible LED devices such as strip, CPU fans, coolers, chassis and so on. Users may also synchronize RGB LED devices across the Polychrome RGB Sync-certified accessories to create their own unique lighting effects.

SignalRGB
SignalRGB unifies your RGB devices, offering seamless customization, game-reactive effects, macro automation, and system monitoring. The official partnership empowers ASRock motherboards with advanced lighting control, enhances compatibility with a diverse range of RGB devices, and provides greater customization flexibility.

Šim produktam ir 36 mēnešu garantija.

Parametri

KopsavilkumsAsrock B860M-X Gen5. Processor manufacturer: Intel, Processor socket: LGA 1851 (Socket V1), Compatible processor series: Intel Core Ultra (Series 2). Supported memory types: DDR5-SDRAM, Maximum internal memory: 128 GB, Memory slots type: DIMM. Supported storage drive interfaces: SATA III, M.2, Supported storage drive types: HDD & SSD. Ethernet interface type: 2.5 Gigabit Ethernet, LAN controller: Dragon RTL8125BG. Component for: PC, Motherboard form factor: micro ATX, Motherboard chipset family: Intel
Ražotāja datu lapahttps://www.asrock.com/MB/Intel/B860M-X%20Gen5/index.asp#Overview
CN kods84733020
Vienības kastes augstums0.06
Vienības kastes garums0.295
Vienības kastes platums0.265
Mātesplates mikroshēmu komplektsIntel B860
Audio mikroshēmaRealtek ALC897
KomponentsPC
Mātesplates formas faktorsmicro ATX
Audio izvades kanāli7.1 channels
Mātesplates mikroshēmu komplekta saimeIntel
Atbalstītās Windows operētājsistēmasWindows 11 x64
Procesora ražotājsIntel
Procesora ligzdaLGA 1851 (Socket V1)
Saderīgo procesoru sērijaIntel Core Ultra (Series 2)
Maksimālais SMP procesoru skaits1
Atbalstītie atmiņas tipiDDR5-SDRAM
Atmiņas slotu skaits2
Atmiņas slotu tipsDIMM
Atmiņas kanāliDual-channel
ECC saderībaNon-ECC
Maksimālā iekšējā atmiņa128 GB
Nebuferēta atmiņaYes
Atbalstītie krātuves disku tipiHDD & SSD
Atbalstītās glabāšanas disku saskarnesSATA III,M.2
HDCPYes
HDCP versija2.3
USB 2.0 savienotāji2
USB 3.2 Gen 1 (3.1 Gen 1) savienotāji2
SATA III savienotāju skaits4
Priekšējā paneļa audio savienotājsYes
ATX barošanas savienotājs (24 kontaktu)Yes
CPU ventilatora savienotājsYes
CPU ventilatora savienotāju skaits2
Šasijas ventilatoru savienotāju skaits2
Peripheral (Molex) barošanas savienotāji (4 pin)1
EPS barošanas savienotājs (8 kontaktu)Yes
EPS barošanas savienotāju skaits (8 kontaktu)1
TPM savienotājsYes
RGB LED kontaktrindaYes
RGB LED kontaktu savienotāju skaits4
USB 2.0 portu skaits2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A portu skaits3
USB 3.2 Gen 2x2 Type-C portu skaits1
Ethernet LAN (RJ-45) pieslēgvietas1
HDMI portu skaits1
DisplayPort pieslēgvietu skaits1
DisplayPort versija1.4
Austiņu izejas1
Līnijas ieejaYes
Ethernet/LANYes
Ethernet saskarnes tips2.5 Gigabit Ethernet
LAN kontrollerisDragon RTL8125BG
Wi-FiNo
PCI Express x1 (Gen 4.x) sloti1
PCI Express x4 (Gen 4.x) sloti1
PCI Express x16 (Gen 5.x) sloti1
M.2 M slotu skaits1
BIOS tipsEFI AMI
BIOS atmiņas izmērs256 Mbit
Platums244 mm
Dziļums218 mm
Komplektā iekļauti kabeļiSATA
Skrūves iekļautasYes
Vienības aprēķinātais svars1.18 kg
Vienības aprēķinātais tilpums0.005668 cubm
Vienības piegādes kastē10
Kastes svars11.8000001907349 kg
product_attr.UNIT_WIDTH26.5 cm
Vienības paletē0
Kastes augstums32 cm
product_attr.UNIT_DEPTH29.5 cm
Kastes dziļums54.5 cm
product_attr.UNIT_HEIGHT6 cm
Kastes platums32.5 cm
NosaukumsMB B860 S1851 MATX/B860M-X GEN5 ASROCK