Mainboard|ASROCK|Intel B860|LGA 1851 (Socket V1)|micro ATX|RAM DDR5-SDRAM|2xSlots|Wi-Fi Yes|Bluetooth Yes|1xNumber of M.2 (M) slots|B860MROCKWIFI

  • Produkta kods: B860M ROCK WIFI
  • Stāvoklis: Jauns
CenaSkaitsPiegāde

154.52

127.70 € (bez PVN 21%)

0

Paredzamā pieejamība:29.04.2026.

Apraksts

Rock Series brings reliable performance and solid quality in a clean, modern design—ready for work, study, and gaming with practical, well-balanced features.

Digi Power
This motherboard uses a next generation digital PWM (Pulse-Width Modulation) design, providing CPU a smooth and efficient power source which expands the lifespan and stability of the motherboard.

DDR5 XMP & EXPO Support
Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.

PCIe Gen5 Blazing M.2
The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128Gb/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

Aluminum Heatsink
The first thing that catches the eye is the optimized Aluminum Heatsink Design. Heatsinks are crucial for efficient heat dissipation, especially during heavy workloads like gaming or productivity tasks. Motherboard that built with heatsinks can effectively manage thermal performance, hence ensure system stability and durability effortlessly.

Wi-Fi 6E 802.11axe
WiFi 6E technology has extended to the whole new 6GHz spectrum band, providing more WiFi capability and giving an even better and faster internet traffic. In addition to deliver higher speeds, the WiFi 6E also enhances the lower latency and supports service levels that are equivalent to 5G networks.

Dragon 2.5 Gb/s LAN
The intelligent 2.5Gb/s LAN platform is built for maximum networking performance for the demanding requirements of home networking, content creators, online gamers and high-quality streaming media. Boost networking performance up to 2.5X the bandwidth compared to the standard gigabit Ethernet, you’ll enjoy the faster and uncompromised connectivity experience for gaming, file transfers and backups.

Front USB 3.2 Gen1 Type-C
Front USB 3.2 Gen1 Type-C header delivers up to 5 Gbps data transfer rate and next generation reversible USB design to the front panel of computer case.

POLYCHROME RGB
This motherboard features onboard RGB headers and addressable RGB headers that allow motherboard to be connected to compatible LED devices such as strip, CPU fans, coolers, chassis and so on. Users may also synchronize RGB LED devices across the Polychrome RGB Sync-certified accessories to create their own unique lighting effects.

SignalRGB
SignalRGB unifies your RGB devices, offering seamless customization, game-reactive effects, macro automation, and system monitoring. The official partnership empowers ASRock motherboards with advanced lighting control, enhances compatibility with a diverse range of RGB devices, and provides greater customization flexibility.

Šim produktam ir 36 mēnešu garantija.

Parametri

SummaryAsrock B860M Rock WiFi. Processor manufacturer: Intel, Processor socket: LGA 1851 (Socket V1), Compatible processor series: Intel Core Ultra (Series 2). Supported memory types: DDR5-SDRAM, Maximum internal memory: 128 GB, Memory slots type: DIMM. Supported storage drive interfaces: M.2, SATA III. Ethernet interface type: 2.5 Gigabit Ethernet, LAN controller: Dragon RTL8125AG, Top Wi-Fi standard: Wi-Fi 6E (802.11ax). Component for: PC, Motherboard form factor: micro ATX, Motherboard chipset family: Intel
Ražotājs datu lapahttps://www.asrock.com/mb/Intel/B860M%20Rock%20WiFi/index.asp#Specification
Audio mikroshēmaRealtek ALC897
Audio izvades kanāli7.1 channels
KomponentsPC
Motherboard mikroshēmu komplektsIntel B860
Motherboard mikroshēmu komplekts saimeIntel
Motherboard formas faktorsmicro ATX
Windows operētāj sistēmas atbalstītsWindows 11 x64
Saderīgs procesors sērijaIntel Core Ultra (Series 2)
Procesors ražotājsIntel
Procesors ligzdaLGA 1851 (Socket V1)
ECC СompatibilityNon-ECC
Maksimālais iekšējais atmiņa128 GB
Atmiņa kanāliDual-channel
Atmiņa sloti tipsDIMM
Numurs Of atmiņa sloti2
Atbalstīts atmiņa tipiDDR5-SDRAM
Nebuferēts atmiņaYes
Atbalstīts glabāšana dzinis InterfacesM.2,SATA III
HDCPYes
HDCP versija2.3
ATX barošanas savienotājs (24 kontaktu)Yes
CPU ventilatora savienotājsYes
Priekšējā panelis audio savienotājsYes
Numurs Of šasijas ventilatora savienotāji2
Numurs Of CPU ventilatora savienotāji1
Numurs Of RGB LED kontakts Headers1
Numurs of SATA III savienotāji4
RGB LED PIN HeaderYes
TPM savienotājsYes
USB 2 0 Connectors2
USB 3 2 Gen 1 3 1 Gen 1 Connectors2
DisplayPort versija1.4
DisplayPorts daudzums1
Ethernet LAN (RJ-45) pieslēgvietas1
HDMI portu skaits1
Ievades līnijaYes
Mikrofons inYes
USB 2.0 porti skaits2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A porti skaits3
USB 3.2 Gen 2x2 Type-C porti skaits1
BluetoothYes
Bluetooth Versija5.3
Ethernet Saskarne Tips2.5 Gigabit Ethernet
ETHERNET/LANYes
LAN kontrollerisDragon RTL8125AG
Augša Wi-Fi standartsWi-Fi 6E (802.11ax)
Wi-FiYes
Wi-Fi standarti802.11a/802.11b/802.11g/Wi-Fi 4 (802.11n)/Wi-Fi 5 (802.11ac)/Wi-Fi 6E (802.11ax)
Numurs Of M 2 M sloti1
PCI Express X1 Gen 4 X Sloti1
PCI Express X16 Gen 5 X Sloti1
BIOS atmiņa izmērs256 Mbit
BIOS TipsUEFI AMI
Dziļums218 mm
Platums244 mm
Antena iekļautaYes
Komplektā iekļauti kabeļiSATA
Vienība Calculated skaļums0.005357 cubm
Vienība Calculated svars1.19 kg