Mainboard|ASROCK|B860 Rock WiFi 7|Intel B860|LGA 1851 (Socket V1)|ATX|RAM DDR5-SDRAM|4xSlots|Wi-Fi Yes|Bluetooth Yes|3xNumber of M.2 (M) slots|B860ROCKWIFI7

  • Produkta kods: B860 ROCK WIFI 7
  • EAN: 4711581494176
  • Stāvoklis: Jauns
CenaSkaitsPiegāde

164.68

136.10 € (bez PVN 21%)

2

23.04.

Apraksts

Performance
Optimized VRM Design
VRM Design
8+1+1+1+1 Power Phase Design

Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers stable and reliable performance while maintaining low operating temperatures for advanced gamers as well.

Dr. MOS
Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.

Power Connector
Hi-Density Power Connector

CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.

6 Layer PCB
The 6 Layer PCB provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency for memory overclocking! Thus, it's able to support the latest memory modules with most extreme memory performance!

DDR5 XMP & EXPO Support
Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.

High Speed M.2 Solution
PCIe Gen5 Blazing M.2

The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128Gb/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

Hyper M.2 Gen4 x4
Supports PCI Express 4.0 M.2 SSDs, it is capable of perform twice the speed compared to previous 3rd generation, giving a lightning fast data transferring experience.

Intelligent Cooling Design
Aluminum Heatsink

The first thing that catches the eye is the optimized Aluminum Heatsink Design. Heatsinks are crucial for efficient heat dissipation, especially during heavy workloads like gaming or productivity tasks. Motherboard that built with heatsinks can effectively manage thermal performance, hence ensure system stability and durability effortlessly.

PWM/DC Fan Support
ASRock fan headers automatically detect whether fans are running in DC or PWM mode, allowing users to fine-tune the fan curve and achieve quieter operation.

Fan-Tastic Tuning
ASRock Fan-Tastic Tuning function enables users to auto-detect the minimum duty of each fan with a single click. Users can also easily adjust the fan curve via the visualized UI interface, meeting their system's cooling performance and noise reduction requirements.

Connectivity
Wi-Fi 7
Enhanced VR Experience

Wi-Fi 7 offers higher data throughput, lower latency, and Multi-link Operation. These features ensure a smooth and real-time interactive experience, making the VR/AR experience more immersive and connected.

Wi-Fi 7 802.11be
Latest WiFi 7 technology delivers extreme wireless internet speeds and low latency, with higher throughput and Multi-RU as well as puncturing technology. The new WiFi 7(802.11be) technology is able to accelerate cloud-based gaming, 8K video streaming, and video conferencing.

Multi-link Operation(MLO)
Multi-link Operation (MLO) enables the simultaneous use of multiple bands and channels, boosting speed and throughput while reducing latency for a smoother, faster internet experience.

Dragon 2.5 Gb/s LAN
The intelligent 2.5Gb/s LAN platform is built for maximum networking performance for the demanding requirements of home networking, content creators, online gamers and high-quality streaming media. Boost networking performance up to 2.5X the bandwidth compared to the standard gigabit Ethernet, you’ll enjoy the faster and uncompromised connectivity experience for gaming, file transfers and backups.

Front USB 3.2 Gen1 Type-C
Front USB 3.2 Gen1 Type-C header delivers up to 5 Gbps data transfer rate and next generation reversible USB design to the front panel of computer case.

Stylish Design
POLYCHROME RGB

This motherboard features onboard RGB headers and addressable RGB headers that allow motherboard to be connected to compatible LED devices such as strip, CPU fans, coolers, chassis and so on. Users may also synchronize RGB LED devices across the Polychrome RGB Sync-certified accessories to create their own unique lighting effects.

SignalRGB
SignalRGB unifies your RGB devices, offering seamless customization, game-reactive effects, macro automation, and system monitoring. The official partnership empowers ASRock motherboards with advanced lighting control, enhances compatibility with a diverse range of RGB devices, and provides greater customization flexibility.

DIY Friendly
Reinforced Steel Slot [PCIe 5.0 Version]

The reinforced steel slot is capable of supporting PCI Express 5.0 standard. The various benefits include:
- Extra anchor points
- Stronger latch
- Ensure signal stability
- Make sure heavy graphics cards to be well-installed.

EZ Setting
Auto Driver Installer

No need to worry about lack of disk drive! Asrock preinstall LAN driver to ensure that you are able to install all drivers needed in an easier way than using SCD.

Pre-Installed IO Shield
ASRock strives offer only the cutting edge technology with the most user-friendly design. The pre-installed IO Shield design makes motherboard to be well-installed in the chassis precisely for preventing any interferences and speed up the set-up process.

EZ Installation
Post Status Checker

Displays the real-time status of CPU, DRAM, VGA, and BOOT device with colored LEDs during startup. A simple and efficient way to check system operation at a glance.

Toolless SSD Installation
SSD installation is simplified with a quick release latch, making the installation super easy & simple./

Performance
Optimized VRM Design
VRM Design
8+1+1+1+1 Power Phase Design

Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers stable and reliable performance while maintaining low operating temperatures for advanced gamers as well.

Dr. MOS
Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.

Power Connector
Hi-Density Power Connector

CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.

6 Layer PCB
The 6 Layer PCB provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency for memory overclocking! Thus, it's able to support the latest memory modules with most extreme memory performance!

DDR5 XMP & EXPO Support
Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.

High Speed M.2 Solution
PCIe Gen5 Blazing M.2

The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128Gb/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

Hyper M.2 Gen4 x4
Supports PCI Express 4.0 M.2 SSDs, it is capable of perform twice the speed compared to previous 3rd generation, giving a lightning fast data transferring experience.

Intelligent Cooling Design
Aluminum Heatsink

The first thing that catches the eye is the optimized Aluminum Heatsink Design. Heatsinks are crucial for efficient heat dissipation, especially during heavy workloads like gaming or productivity tasks. Motherboard that built with heatsinks can effectively manage thermal performance, hence ensure system stability and durability effortlessly.

PWM/DC Fan Support
ASRock fan headers automatically detect whether fans are running in DC or PWM mode, allowing users to fine-tune the fan curve and achieve quieter operation.

Fan-Tastic Tuning
ASRock Fan-Tastic Tuning function enables users to auto-detect the minimum duty of each fan with a single click. Users can also easily adjust the fan curve via the visualized UI interface, meeting their system's cooling performance and noise reduction requirements.

Connectivity
Wi-Fi 7
Enhanced

Šim produktam ir 36 mēnešu garantija.

Parametri

SummaryAsrock B860 Rock WiFi 7. Processor manufacturer: Intel, Processor socket: LGA 1851 (Socket V1), Compatible processor series: Intel Core Ultra (Series 2). Supported memory types: DDR5-SDRAM, Maximum internal memory: 256 GB, Memory slots type: DIMM. Supported storage drive interfaces: PCI Express 4.0, PCI Express 5.0, SATA III, Supported storage drive types: HDD & SSD, RAID levels: 0, 1, 5, 10. Maximum resolution: 3840 x 2160 pixels. USB connector type: USB Type-A, USB Type-C
Ražotājs datu lapahttps://asrock.com/MB/Intel/B860%20Rock%20WiFi%207/index.asp
Vienība kastes augstums0.075
Vienība kastes garums0.35
Vienība kastes platums0.28
Audio mikroshēmaRealtek ALC897
Audio izvades kanāli7.1 channels
KomponentsPC
Motherboard mikroshēmu komplektsIntel B860
Motherboard mikroshēmu komplekts saimeIntel
Motherboard formas faktorsATX
Produkts krāsaBlack
Windows operētāj sistēmas atbalstītsWindows 11 x64
Saderīgs procesors sērijaIntel Core Ultra (Series 2)
Procesors ražotājsIntel
Procesors ligzdaLGA 1851 (Socket V1)
Atbalstīts procesors ligzdasLGA 1851
ECC СompatibilityNon-ECC
Maksimālais iekšējais atmiņa256 GB
Atmiņa kanāliDual-channel
Atmiņa sloti tipsDIMM
Numurs Of atmiņa sloti4
Atbalstīts atmiņa pulkstenis ātrums Max8666 MHz
Atbalstīts atmiņa tipiDDR5-SDRAM
Nebuferēts atmiņaYes
Numurs of glabāšana drives atbalstīts7
RAID līmeņi0/1/10/5
RAID atbalstsYes
Atbalstīts glabāšana dzinis InterfacesPCI Express 4.0,PCI Express 5.0,SATA III
Atbalstīts glabāšana dzinis tipiHDD & SSD
HDCPYes
HDCP versija2.3
Atbalstīts augsts dinamiskais diapazons (HDR)Yes
Maksimālais izšķirtspēja3840 x 2160 pixels
Paralēls apstrāde tehnoloģija atbalstsNot supported
12v Jauda SavienotājsYes
ATX barošanas savienotājs (24 kontaktu)Yes
CPU ventilatora savienotājsYes
EPS barošanas savienotājs (8 kontaktu)Yes
Priekšējā panelis audio savienotājsYes
Numurs Of šasijas ventilatora savienotāji4
Numurs Of CPU ventilatora savienotāji2
Numurs Of Eps barošanas savienotāji 8 kontakts2
Numurs Of RGB LED kontakts Headers1
Numurs of SATA III savienotāji4
Numurs Of ūdens sūknis savienotāji1
RGB LED PIN HeaderYes
TPM savienotājsYes
USB 2 0 Connectors2
USB 3 2 Gen 1 3 1 Gen 1 Connectors2
Ethernet LAN (RJ-45) pieslēgvietas1
HDMI portu skaits1
HDMI versija2.1
Austiņu izejas3
Ievades līnijaYes
Mikrofons inYes
USB 2.0 porti skaits2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A porti skaits6
USB 3.2 Gen 1 (3.1 Gen 1) Type-C porti skaits1
USB savienotājs tipsUSB Type-A/USB Type-C
WIFI AP Antena Jack2
BluetoothYes
Bluetooth Versija5.4
Ethernet Saskarne Tips2.5 Gigabit Ethernet/Fast Ethernet/Gigabit Ethernet
ETHERNET/LANYes
LAN kontrollerisDragon RTL8125BG
Augša Wi-Fi standartsWi-Fi 7 (802.11be)
Wi-FiYes
Wi-Fi standarti802.11a/802.11b/802.11g/Wi-Fi 4 (802.11n)/Wi-Fi 5 (802.11ac)/Wi-Fi 6 (802.11ax)/Wi-Fi 6E (802.11ax)/Wi-Fi 7 (802.11be)
1st M 2 augstākais PCI Express ģenerēšana5.0
1st M 2 lielākais atslēga izmērs2280
2nd M 2 augstākais PCI Express ģenerēšana4.0
2nd M 2 lielākais atslēga izmērs2280
3rd M 2 augstākais PCI Express ģenerēšana4.0
3rd M 2 lielākais atslēga izmērs2280
Numurs Of M 2 M sloti3
PCI Express X16 Gen 4 X Sloti1
PCI Express X16 Gen 5 X Sloti1
BIOS atmiņa izmērs256 Mbit
BIOS TipsUEFI AMI
Dziļums244 mm
Platums305 mm
Antena iekļautaYes
Komplektā iekļauti kabeļiSATA
Atbilstības sertifikātiCE/Federal Communications Commission (FCC)
ModelisB860 Rock WiFi 7
Vienības uz palete0
Vienības uz piegāde kastes5
Vienība Calculated skaļums0.008928 cubm
Vienība Calculated svars1.83 kg