An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Šim produktam ir 3 mēnešu garantija.
| Cena | Skaits | Piegāde | |
|---|---|---|---|
124.01 € 102.66 € (bez PVN 21%) | 1 | 21.07. |
An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Šim produktam ir 3 mēnešu garantija.
| Bruto dziļums MM | 272.00 mm |
|---|---|
| Bruto dziļums galvenais Carton | 560.00 mm |
| Bruto augstums MM | 270.00 mm |
| Bruto augstums galvenais Carton | 300.00 mm |
| Bruto svars | 1.10 kg |
| Bruto platums MM | 65.00 mm |
| Bruto platums galvenais Carton | 360.00 mm |
| Net Svars | 0.78 kg |
| Tīkla svars galvenais Carton | 11.00 kg |
| Packing daudzums | 1.00 pcs |
| Paletes daudzums | 280.00 pcs |
| Papīra Pasteboard | 300.00 g |
| Plastmasas No Pet | 20.00 g |
| Tare svars KG | 0.32 kg |
| Tare svars galvenais Carton | 1.03 kg |
| TI svars KG | 0.03 kg |
| Tilpums M3 | 0.00 m³ |
| Klasifikācija Of akumulatora | CL126:NE:2016-12-09 |
|---|---|
| Composition Of akumulatora | CL127:KT:2016-12-09 |
| Tips Of akumulatora | Accumulator |
| Embeed akumulatora | Yes |
| EEIA nodoklis | No |
| Ražotājs | MSI |
| PET | 2.00 g |
| Atmiņas sloti | 4 |
| Savietojami Procesori | Supports 3rd Gen AMD Ryzen processors and future AMD Ryzen processors with BIOS update |
| Procesora Tips | AMD |
| Mātes plates formas faktors | Micro ATX |
| Atbalstītās atmiņas veidi | DDR4 |
| Procesora Ligzda | AM4 |
| Mikroshēmojums | AMD B |
| Garantija | 3 mēnesis(i) |
| Producer produkts nosaukums | B550M PRO-VDH WIFI |
| Saleout | USED, REFURBISHED, WITHOUT ACCESSORIES, ONLY ANTENNAS AND BACKPANEL INCLUDED |