An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Šim produktam ir 36 mēnešu garantija.
| Cena | Skaits | Piegāde | |
|---|---|---|---|
127.34 € 105.24 € (bez PVN 21%) | 25 | 24.04. |
An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Šim produktam ir 36 mēnešu garantija.
| Bruto dziļums MM | 272 mm |
|---|---|
| Bruto augstums MM | 270 mm |
| Bruto svars | 1.1 kg |
| Bruto platums MM | 65 mm |
| Net Svars | 0.78 kg |
| Packing daudzums | 10 pcs |
| Papīra Pasteboard | 300.00 g |
| Plastmasas No Pet | 20.00 g |
| Tare svars KG | 0.32 kg |
| Tilpums M3 | 0.0047736 m³ |
| Klasifikācija Of akumulatora | CL126:NE:2016-12-09 |
| Composition Of akumulatora | CL127:KT:2016-12-09 |
| Tips Of akumulatora | Accumulator |
| Embeed akumulatora | Yes |
| EEIA nodoklis | No |
| PET | 2.00 g |
| TI svars KG | 0.03 kg |
| Atmiņas sloti | 4 |
|---|---|
| Savietojami Procesori | Supports 3rd Gen AMD Ryzen processors and future AMD Ryzen processors with BIOS update |
| Procesora Tips | AMD |
| Mātes plates formas faktors | Micro ATX |
| Atbalstītās atmiņas veidi | DDR4 |
| Procesora Ligzda | AM4 |
| Mikroshēmojums | AMD B |
| Garantija | 36 mēnesis(i) |
| Producer produkts nosaukums | B550M PRO-VDH WIFI |
| Bruto dziļums galvenais Carton | 560 mm |
| Bruto platums galvenais Carton | 360 mm |
| Bruto augstums galvenais Carton | 300 mm |
| Tīkla svars galvenais Carton | 11 kg |
| Tare svars galvenais Carton | 1.028 kg |
| Paletes daudzums | 280 pcs |
| Ražotājs | MSI |
| Ražotājs datu lapa | https://www.msi.com/Motherboard/B550M-PRO-VDH-WIFI/Gallery#lg=1 |