ARCTIC TP-4 120X20X1.5 Premium Performance Thermal Pad (ACTPD00067A)
High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Safe Application
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Tailored Made for SP6
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
Water Block Design for SP6
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Available in Various Thicknesses and Sizes
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Versatile Applications
Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components. Flexible, vibration-dampening, and easy to cut.
General Specifications
Operating Ambient Temperature -40-200 °C
Dimensions 120 (L) x 20 (W) x 1 (H) mm
Thermal Pad Specifications
Hardness 50 Shore OO
Specific Gravity 3.4 g/cm³
Breakdown Voltage 8620 V/mil
Dielectric Constant 7.2 @1 MHz
Volume Resistance 1.52 x 10^13 Ω-cm
Flammability Rating UL 94 V-0
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ARCTIC TP-4 120X20X1.5 Premium Performance Thermal Pad (ACTPD00067A)
High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Safe Application
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Tailored Made for SP6
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
Water Block Design for SP6
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Available in Various Thicknesses and Sizes
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Versatile Applications
Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components. Flexible, vibration-dampening, and easy to cut.
General Specifications
Operating Ambient Temperature -40-200 °C
Dimensions 120 (L) x 20 (W) x 1 (H) mm
Thermal Pad Specifications
Hardness 50 Shore OO
Specific Gravity 3.4 g/cm³
Breakdown Voltage 8620 V/mil
Dielectric Constant 7.2 @1 MHz
Volume Resistance 1.52 x 10^13 Ω-cm
Flammability Rating UL 94 V-0
Šim produktam ir 3 mēnešu garantija.